| Part No. | |
|---|---|
| INIC-1607E C11
Controller |
|
| XC4VLX80-10FF1148C
Processor |
|
| SPC5200CVR400B
IC |
|
| K8T800 Pro
Processor |
|
| VT6103
IC |
|
| M391T6553CZ2-CE7
DDRII Module |
|
| ST3222CD
|
|
| ST3222ECDR
|
|
| 281873-3
|
|
| 75AF36-01-10N-C
|
|
| 0010-76430
|
|
| VJ0402A4R7CXBAT
CAPACITOR CHIP, CHAR: NPO, 4.7 PFD,TOL: +-0.25PF, 100VDCW, SIZE:0.040X0.030X0.030", NI BARRIER TERM |
|
| TCSCS1E685KCAR
SOLID TANTALUM CAP.CHIP, 25VDCW, 6.8UFD, TOL: 10% SIZE: 6.0X3.2X2.5MM, TAPE AND REEL PACKAGE |
|
| TPSA685K010S1800
SOLID TANTALUM CAP.CHIP, 10VDC, 6.8UFD TOL: 10%, SIZE: 0.126X0.063X0.063", SURFACE MOUNT |
|
| DD44M4B800C-50
PLUG, 44 SIZE-22D PIN CONTACTS, SOLDER HIGH DENSITY, D-CONNECTOR, BRACKET MOUNT |
|
| MS-363-051-435-220S
PC CONNECTOR,RECEPTACLE,R.ANGLE,51-POSITIONS,3-ROW SOCKET, RIGHT ANGLE, DIP SOLDER, 0.109" |
|
| MS-363-051-435-22OS
PC CONNECTOR,RECEPTACLE,R.ANGLE,51-POSITIONS,3-ROW SOCKET, RIGHT ANGLE, DIP SOLDER, 0.109" |
|
| SSM-5210-15-TRM-02
SSM - STRAIGHT FLANGE MOUNT FEMALE JACK RECEPTACLE, 2-HOLE, PASSIVATED STAINLESS STEEL |
|
| VF3BH-1-66.666MHZ
CRYSTAL CONTROLLED CLOCK OSC., FO: 66.666000MHZ VCC:3.3V,TC:50PPM,4-LEAD SMD PACK. D.C:45/55%, E/D |
|
| VF3BH-1-36.000MHZ
CRYSTAL CONTROLLED CLOCK OSC., FO: 36.000000MHZ VCC:3.3V,TC:50PPM,4-LEAD SMD PACK. D.C:45/55%, E/D |
|
| VF3BH-1-25MHZ
CRYSTAL CONTROLLED CLOCK OSC., FO: 25.000000MHZ VCC:3.3V, TC:50PPM, 4-LEAD SMD PACK. D.C:45/55%, E/ |
|
| SBSMP050-0474MXT T&R
FILTER, HIGH CURRENT, PI, SMT, 50VDC/10.0A CAPACITANCE: 470NF, TOL.: +-20%,OP. TEMP -55 TO 125C |
|
| NFM18CC471R1C3 T&R
FILTER EMI SUPPRESSION, CHIP, T.RANGE: -55C TO 125C, RATED VOLTAGE: 16VDC, RATED CURENT: 0.3ADC |
|
| 2743037447
SURFACE MOUNT BEADS IN FAIR-RITE IMPEDANCE: 45 OHM AT 25MHZ MIN. -55 TO 125C |
|
| BLM21PG221SN1D
EMI CHIP FERRITE BEADS 220 OHM AT 100MHZ, 2000MA, T.RANGE: -55C TO 125C |
|
| UPC3215TB-E3
AMPLIFIER, MMIC WIDEBAND, F/OP: 0.100-2.6GHZ, GAIN:18.5DB, NOISE:3.0DB |
|
| CR1206-FX-34R0ELF
RESISTOR CHIP, THICK FILM, 34.0 OHM , TOL: 1% 0.25W/70C, T.C.:100PPM/C,SIZE: 3.20X1.60X0.55MM |
|
| CRCW120634R0FKTA
RESISTOR CHIP, THICK FILM, 34.0 OHM , TOL: 1% 0.25W/70C, T.C.:100PPM/C,SIZE: 3.20X1.60X0.55MM |
|
| MCR18EZHF-34R0 T&R
RESISTOR CHIP, THICK FILM, 34.0 OHM , TOL: 1% 0.25W/70C, T.C.:100PPM/C,SIZE: 3.20X1.60X0.55MM |
|
| RC1206FR-0734R0L
RESISTOR CHIP, THICK FILM, 34.0 OHM , TOL: 1% 0.25W/70C, T.C.:100PPM/C,SIZE: 3.20X1.60X0.55MM |
|
| MAX3485EESA
INTERFACE IC-RS485/RS422 TRANSCEIVER, HALF DUPLEX, T.RANGE: -40C TO 85C, 8-PIN SO PACKAGE |
|
| MAX3485EESA+
INTERFACE IC-RS485/RS422 TRANSCEIVER, HALF DUPLEX, T.RANGE: -40C TO 85C, 8-PIN SO PACKAGE |
|
| M81822/13-B30-5
WIRE-WRAP, INSULATED, 30-AWG SOLID, 5-GREEN SILVER-COATED COPPER, EXTRUDED TEFZEL INSULATION |
|
| TG110-E050N5
ISOLATION MODULE, HIGH SPEED LAN, DUAL T.RANGE:-40C TO 85C, 16-PIN SOIC |
|
| TG110-E050N5RL
ISOLATION MODULE, HIGH SPEED LAN, DUAL T.RANGE:-40C TO 85C, 16-PIN SOIC |
|
| RO4003
DIELECTRIC MAT. RO 4003 SIZE: 12" X 18" X 16 MIL 2ND SIDE 1OZ DIELECTRIC 3.38 |
|
| LOCTITE-222
ADHESIVE "LOCTITE- 222" IN CAN OF 50 CC TEMP. RANGE:-55C TO +150C. GEL TIME:10-30 MINUTE. |
|
| LSZB3PDL5X8
METALLIC SHIELDING CANCEL CUSHION BAG, 5" X 8" WITH PINK ANTI-STATIC POLY INNER LAYER & POCKET |
|
| CL05B152KB5NNNC
CAPACITOR CHIP, CHAR: X7R, 1500 PFD, TOL: 10%, 50VDCW, SIZE:0.040X0.030X0.030", NI BARRIER TER. |
|
| CL05B152KBNC
CAPACITOR CHIP, CHAR: X7R, 1500 PFD, TOL: 10%, 50VDCW, SIZE:0.040X0.030X0.030", NI BARRIER TER. |
|
| VJ0402Y152KXAAC
CAPACITOR CHIP, CHAR: X7R, 1500 PFD, TOL: 10%, 50VDCW, SIZE:0.040X0.030X0.030", NI BARRIER TER. |
|
| MPC8321CZQAFDC
MICRO-PROCESSOR, PQ II PRO, CMOS,32-BIT, CORE FREQ.:333MHZ, T.RANGE:-40C TO 105C, 516-PIN PBGA PACK. |
|
| A-0805-C-00DB
THIN FILM CHIP ATTENUATOR, F/OP: DC-18.0GHZ, ATT: 0DB, TOL.: 0.3DB, SIZE: 0805 (0.079X0.049") |
|
| AG203-86
INGAP HBT GAIN BLOCK, BUFFER AMP., F/O:DC-6000MHZ, P1DB:+8.0DBM @ 900MHZ, GAIN:16.2DB @ 1900MHZ |
|
| AG203-86G
INGAP HBT GAIN BLOCK, BUFFER AMP., F/O:DC-6000MHZ, P1DB:+8.0DBM @ 900MHZ, GAIN:16.2DB @ 1900MHZ |
|
| AG303-86
INGAP HBT GAIN BLOCK, BUFFER AMP., F/O: DC-6000MHZ, GAIN: 20.4DB @ 900MHZ, SMT, 4-PIN SOT-86 PACKAGE |
|
| AG303-86G
INGAP HBT GAIN BLOCK, BUFFER AMP., F/O: DC-6000MHZ, GAIN: 20.4DB @ 900MHZ, SMT, 4-PIN SOT-86 PACKAGE |
|
| RCC-0402PW50R0F T&R
RESISTOR CHIP, THICK FILM, HIGH FREQ.,50 OHM, TOL: 1%,0.08W/70C, T.C.:100PPM/C, SIZE:0.04X0.02X0.02" |
|
| CMHZ4617TRLEADFREE
VOLTAGE REGULATOR DIODE, SI, 0.500W/75C, 2.4V, TOL: 5%, SOD-123 SURFACE MOUNT PACKAGE |
|
| EN5336QI-T
SYNCHRONOUS BUCK PWM DC-DC CONVERTER, V/IN: 2.375-5.5V, I/OUT:3.0A,T.R:-40C TO 85C, 44-PIN QFN PACK. |
|
| EN5312QI
SYNCHRONOUS BUCK PWM DC-DC CONVERTER, V/IN: 2.4-5.5V, I/OUT: 1.0A, T.R:-40C TO 85C, 20-PIN QFN PACK. |
|
| MAX1213NEGK+D
INTERFACE IC-A/D CONVERTER, MONOLITHIC, 12-BIT, 170MSPS, 68-PIN QFN-EP PACK, (DRY PACK.) |
|
| MT48LC4M32B2F5-7IT:G
IC MEMORY, 4M X32-BIT DRAM, CMOS, T.RANGE: -40C TO 85C, 90-BALL FBGA (8X13MM) PACKAGE |
|
| MT47H32M16HW-3IT:G
IC MEMORY, 8MX16X4 BANKS, DDR2 SDRAM, CMOS, T.RANGE: -40C TO 85C, 84-BALL FBGA (8X12.5MM) PACKAGE |
|
| MT47H32M16HW-25EIT:G
IC MEMORY, 8MX16X4 BANKS, DDR2 SDRAM, CMOS, T.RANGE: -40C TO 85C, 84-BALL FBGA (8X12.5MM) PACKAGE |
|
| EPCS64SI16N
IC MEMORY 64M X1-BIT ROM, SERIAL FLASH MEMORY, T.RANGE: -40C TO 85C, 16-PIN PLASTIC SOIC PACKAGE |
|
| S29GL256P90TFI010
IC MEMORY 32M X16-BIT ROM, CMOS, PAGE-MODE FLASH, T.RANGE: -40C TO 85C, 56-PIN TSOP PACKAGE |
|
| EPM7256AEFI100-7
ERASABLE PROGRAMMABLE LOGIC DEVICE, CMOS, T.RANGE: -40C TO 85C, 100-PIN FBGA PACKAGE |
|
| EP3C120F484I7
CYCLONE-III FPGA DEVICE, 119088 LOGIC ELEMENTS, T.JUNCTION: -40C TO 100C, 484-PIN FBGA PACKAGE |
|
| PNP-1507-P22-G-CC
FREQUENCY SYNTHESIZER, F/O: 1730-2200MHZ, STEP SIZE: 1000KHZ, SMT PACK.,TYPE: P22, CONFORMAL COATING |
|
| PNP-1506-P22-G-CC
FREQUENCY SYNTHESIZER, F/O: 1300-1750MHZ, STEP SIZE: 1000KHZ, SMT PACK.,TYPE: P22, CONFORMAL COATING |
|
| PNP-1711-P22-G
FREQUENCY SYNTHESIZER, F/O: 3000-3285MHZ, STEP SIZE: 2500KHZ, SMT PACK.,TYPE: P22 |
|
| PNP-1592-P22-G
FREQUENCY SYNTHESIZER, F/O: 3270-3580MHZ, STEP SIZE: 2500KHZ, SMT PACK.,TYPE: P22 |
|
| L5A0882
B BASE TX 3DS3 16QAM |
|
| L5A0321
|
|
| PHRNM3
Threaded insert,standard,steel,zinc plated and clear passivated,M3 |
|
| MC33030DW
|
|
| SMA87
|
|
| 1N5907JTXV
TRANSIENT SUPPRESSOR |
|
| LM260WU2-SLA2
|
|
| ITSX88E4
|
|
| LQ036Q1DA01
|
|
| LM240WU4-SLA1
|
|
| TS0307
CHIP ATTENUATOR |
|
| 1N6276A
|
|
| CDNBS08-T36C
|
|
| 94518-0301
|
|
| FN326-6/01
schaffner filter |
|
| 361830-YF200-05A
|
|
| RXM-433-LC-S
receiver |
|
| HLMP-AM64-34BDD
Mini Oval LEDs |
|
| NAS1553B4D8SP
|
|
| A90080.10
TRANSMITTER |
|
| CHP2-100-2214-LF13
PASSIVE |
|
| HS4910-1002
|
|
| 561-5201-090
|
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